Umehluko phakathi kocwecwe lwethusi olugoqiwe (ucwecwe lwethusi lwe-RA) ne-electrolytic copper foil (ED copper foil)

I-copper foiliyimpahla edingekayo ekukhiqizeni ibhodi lesifunda ngoba inemisebenzi eminingi efana nokuxhuma, ukuqhutshwa kwe-conductivity, ukuchithwa kokushisa, nokuvikela i-electromagnetic. Ukubaluleka kwayo kuyabonakala. Namuhla ngizokuchazela mayelanai-foil yethusi egoqwe(RA) kanye Nomehluko phakathii-electrolytic copper foil(ED) kanye nokuhlukaniswa kwe-PCB ye-copper foil.

 

PCB ucwecwe lwethusikuyinto conductive impahla esetshenziswa ukuxhuma izingxenye electronic kumabhodi wesekethe. Ngokwenqubo yokukhiqiza nokusebenza, ucwecwe lwethusi lwe-PCB lungahlukaniswa ngezigaba ezimbili: ucwecwe lwethusi olugoqiwe (RA) kanye nocwecwe lwethusi lwe-electrolytic (ED).

Ucwecwe lwethusi olugoqiwe lwenziwa ngezikhala zethusi ezimsulwa ngokugoqeka okuqhubekayo nokucindezelwa. Inobuso obushelelezi, ubuhholo obuphansi kanye nokuhamba kahle kukagesi, futhi ifanele ukudluliswa kwesignali ye-high-frequency. Kodwa-ke, izindleko zefoyili yethusi egoqiwe ziphezulu futhi ububanzi bogqinsi bunomkhawulo, ngokuvamile phakathi kuka-9-105 µm.

 

I-Electrolytic copper foil itholakala ngokucubungula i-electrolytic deposition epuleti lethusi. Olunye uhlangothi lubushelelezi kanti olunye lumahhadlahhadla. Uhlangothi oluqinile luhlanganiswe ne-substrate, kuyilapho uhlangothi olubushelelezi lusetshenziselwa i-electroplating noma etching. Izinzuzo ze-electrolytic copper foil izindleko zayo eziphansi kanye nohlu olubanzi logqinsi, ngokuvamile phakathi kuka-5-400 µm. Kodwa-ke, ukuqina kwayo phezulu kuphezulu futhi ugesi wayo awuhambisani kahle, okwenza ingafaneleki ukudluliswa kwesignali yemvamisa ephezulu.

Ukuhlukaniswa kwefoyili yethusi ye-PCB

 

Ngaphezu kwalokho, ngokusho kokuqina kwe-foil yethusi ye-electrolytic, ingahlukaniswa futhi ibe yizinhlobo ezilandelayo:

 

I-HTE(High Temperature Elongation): Ucwecwe lwethusi olunwebeka kakhulu izinga lokushisa, ikakhulukazi olusetshenziswa kumabhodi esekethe anezendlalelo eziningi, lunokudubeka okuhle kwezinga lokushisa eliphezulu namandla okubopha, futhi ubuhwaba ngokuvamile buphakathi kuka-4-8 µm.

 

I-RTF(Reverse Treat Foil): Hlehlisa phatha i-foil yethusi, ngokungeza i-resin ethile enamathela ohlangothini olubushelelezi lwe-electrolytic copper foil ukuze uthuthukise ukusebenza kokunamathela futhi unciphise ukulukhuni. Ubulukhuni ngokuvamile buphakathi kuka-2-4 µm.

 

I-ULP(Iphrofayili Ephansi Kakhulu): Icwecwe lethusi elinephrofayili ephansi kakhulu, elakhiwe kusetshenziswa inqubo ekhethekile ye-electrolytic, inobuhwaba obuphansi kakhulu futhi ifanele ukudluliswa kwesignali enesivinini esikhulu. Ubulukhuni ngokuvamile buphakathi kuka-1-2 µm.

 

I-HVLP(Iphrofayili ye-High Velocity Low): Ucwecwe lwethusi olunesivinini esiphansi. Ngokusekelwe ku-ULP, ikhiqizwa ngokwandisa isivinini se-electrolysis. Inobuqhwaga obuphansi kanye nokusebenza kahle kokukhiqiza okuphezulu. Ubulukhuni ngokuvamile buphakathi kuka-0.5-1 µm. .